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US 10,872,865 B2Granted
Electric magnetic shielding structure in packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen
Life of this patent
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Abstract
A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.
Claims20
A method comprising:
- forming a plurality of conductive posts, the plurality of conductive posts comprising a first plurality of conductive posts and a second plurality of conductive posts;
- encapsulating the plurality of conductive posts and a device die in an encapsulating material;
- planarizing the plurality of conductive posts, the device die, and the encapsulating material;
- forming a first plurality of conductive features on a first side of the encapsulating material, wherein the first plurality of conductive features comprises:
- first portions electrically coupling to the device die;
- and
- second portions electrically coupling to the plurality of conductive posts;
- and
- forming a second plurality of conductive features on a second side of the encapsulating material, wherein the second plurality of conductive features comprises a conductive ring electrically coupling to the plurality of conductive posts;
- and
- sawing the encapsulating material and overlying and underlying structures to form a package, wherein the first plurality of conductive posts comprises a corner conductive post at each corner of the package, and wherein each of the second plurality of conductive posts is between and aligned to two of the corner conductive posts.
8 more elements
A method comprising:
- forming first conductive posts and second conductive posts over a substrate;
- attaching a device die to the substrate, the second conductive posts being more proximal than the first conductive posts to the device die;
- encapsulating the first conductive posts, the second conductive posts, and the device die in a molding material, a top surface of the molding material being level with the first conductive posts, the second conductive posts, and the device die;
- and
- forming first conductive features, second conductive features, and third conductive features over the top surface of the molding material, the first conductive features being electrically coupled to the first conductive posts, the second conductive features electrically coupling the second conductive posts to the device die, and the third conductive features being electrically coupled to the device die.
2 more elements
A method comprising:
- forming a plurality of conductive posts over a first substrate, the plurality of conductive posts comprising inner conductive posts and outer conductive posts, the outer conductive posts forming a non-continuous rectangular ring, the outer conductive posts comprising corner posts being located at corners of the non-continuous rectangular ring, the outer conductive posts further comprising a side post being located between and aligned with each of the corner posts;
- attaching a device die to the first substrate;
- forming a molding compound around lateral edges of the plurality of conductive posts and the device die, the molding compound having a first side proximal to the first substrate and a second side opposite the first side;
- forming a first plurality of conductive features over the second side of the molding compound;
- removing the first substrate to expose the first side of the molding compound;
- and
- forming a second plurality of conductive features over the molding compound, the second plurality of conductive features forming a continuous ring, the continuous ring being electrically coupled to each of the outer conductive posts.
4 more elements
Dependencies are inferred from the claim text.