Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same

A method of fabricating a package structure, comprising:

• providing a carrier;
• forming a redistribution layer on the carrier, the redistribution layer has a first surface and a second surface opposite to the first surface;
• disposing a bridge structure on the first surface of the redistribution layer;
• forming a plurality of seed layers on the first surface of the redistribution layer and a plurality of through insulator vias on the plurality of seed layers;
• forming an insulating encapsulant on the first surface of the redistribution layer encapsulating the bridge structure, the plurality of through insulator vias and the seed layers;
• forming a dielectric layer on the insulating encapsulant, and patterning the dielectric layer to form a plurality of openings that exposes portions of the plurality of through insulator vias and conductive posts of the bridge structure for connection;
• bonding a first semiconductor die and a second semiconductor die to the plurality of through insulator vias and the bridge structure through a plurality of conductive bumps, wherein the bonding of the first semiconductor die and the second semiconductor die are performed after forming the dielectric layer, and the first semiconductor die and the second semiconductor die each comprises a plurality of conductive pillars that is physically joined with the plurality of conductive bumps, and the plurality of conductive bumps is physically joined with the plurality of through insulator vias and the bridge structure;
• forming an underfill structure filling up the spaces in between each of the conductive pillars, wherein the underfill structure covers and is in physical contact with sidewalls of the plurality of conductive pillars;
• forming a molding compound encapsulating the first semiconductor die and the second semiconductor die;
• de-bonding the carrier to reveal the second surface of the redistribution layer;
• and
• forming a plurality of conductive balls on the second surface of the redistribution layer.

A method of fabricating a package structure, comprising:

• providing a carrier;
• forming a redistribution layer on the carrier, wherein the redistribution layer has a first surface and a second surface opposite to the first surface;
• disposing a bridge structure and forming a plurality of through insulator vias on the first surface of the redistribution layer, wherein the bridge structure comprises a silicon bridge and a plurality of conductive posts, and the plurality of through insulator vias surrounds the bridge structure;
• forming an insulating encapsulant on the redistribution layer to encapsulate the bridge structure and the plurality of through insulator vias;
• forming a dielectric layer on the insulating encapsulant, and patterning the dielectric layer to form a plurality of openings that exposes portions of the plurality of through insulator vias and portions of the plurality of conductive posts of the bridge structure for connection;
• bonding a first semiconductor die and a second semiconductor die to the plurality of through insulator vias and the bridge structure through a plurality of conductive bumps, wherein the first semiconductor die and the second semiconductor die each comprises a plurality of conductive pillars that is physically joined with the plurality of conductive bumps, and the plurality of conductive bumps fills into the plurality of openings of the dielectric layer;
• forming an underfill structure that simultaneously fills up the spaces in between each of the conductive pillars of the first semiconductor die and the second semiconductor die, and fills up the spaces sandwiched between sidewalls of the first semiconductor die and the second semiconductor die;
• forming a molding compound encapsulating the first semiconductor die and the second semiconductor die;
• de-bonding the carrier to reveal the second surface of the redistribution layer;
• forming a plurality of conductive balls on the second surface of the redistribution layer;
• and
• performing a dicing process cutting through the molding compound, the insulating encapsulant and the redistribution layer, so that sidewalls of the molding compound, the insulating encapsulant and the redistribution layer are levelled.