Chip package and method of fabricating the same

A method of fabricating a chip package, the method comprising:

• providing an integrated circuit component with a metallic layer formed thereon;
• attaching the integrated circuit component on a carrier through a die attachment film such that the metallic layer is between the integrated circuit component and the die attachment film, wherein thermal conductivity of the metallic layer is greater than thermal conductivity of the die attachment film;
• forming conductive through vias on the carrier;
• forming an insulating encapsulant to encapsulate the conductive through vias, the integrated circuit component on the carrier;
• forming a redistribution circuit structure on the conductive through vias, the insulating encapsulant and the integrated circuit component;
• after forming a redistribution circuit structure, de-bonding the conductive through vias, the die attachment film and the insulating encapsulant from the carrier;
• removing the die attachment film to reveal the metallic layer;
• and
• electrically connecting a semiconductor device to the conductive through vias such that the die attachment film is between the integrated circuit component and the semiconductor device, wherein the semiconductor device is electrically connected to the integrated circuit component through the conductive through vias and the redistribution circuit structure.

A method, comprising:

• attaching an integrated circuit component on a carrier through an adhesive;
• forming conductive through vias on the carrier;
• forming an insulating encapsulant to encapsulate the adhesive, the integrated circuit component and the conductive through vias on the carrier;
• forming a redistribution circuit structure on the conductive through vias, the insulating encapsulant and the integrated circuit component;
• after forming the redistribution circuit structure, de-bonding the adhesive, the conductive through vias and the insulating encapsulant from the carrier;
• and
• after de-bonding the adhesive, the conductive through vias and the insulating encapsulant from the carrier, removing the adhesive;
• and
• electrically connecting a semiconductor device to the conductive through vias, wherein the semiconductor device is electrically connected to the integrated circuit component through the conductive through vias and the redistribution circuit structure.