Electro-optical package and method of fabrication
AssigneeRockley Photonics Limited
InventorsVivek Raghunathan, Vivek Raghuraman, Karlheinz Muth
Life of this patent
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Abstract
An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.
Claims25
A package, comprising:
- an electronic integrated circuit module;
- a first electro-optical component;
- and
- a photonic integrated circuit,
- the first electro-optical component being in a top surface of the photonic integrated circuit,
- the electronic integrated circuit module comprising a redistribution layer and having a top surface facing toward and overlapping:
- a portion of the first electro-optical component;
- and
- a portion of the photonic integrated circuit.
A method for fabricating a package, the method comprising forming a first intermediate product on a first temporary carrier, the forming of the first intermediate product comprising:
- forming a redistribution layer on the first temporary carrier;
- bonding a via interposer to the redistribution layer;
- bonding a photonic integrated circuit to the redistribution layer;
- and
- attaching an electronic integrated circuit module to the via interposer and to the photonic integrated circuit.
A package, comprising:
- an electronic integrated circuit module;
- a first electro-optical component;
- a photonic integrated circuit;
- and
- a via interposer abutting against a top surface of the electronic integrated circuit module,
- the first electro-optical component being in a top surface of the photonic integrated circuit,
- the top surface of the electronic integrated circuit module facing toward and overlapping:
- a portion of the first electro-optical component;
- and
- a portion of the photonic integrated circuit.
A hybrid interposer, comprising:
- an electro-optical component;
- a photonic integrated circuit;
- and
- a via interposer,
- the electro-optical component being in a top surface of the photonic integrated circuit,
- the via interposer begin adjacent to an edge of the photonic integrated circuit and having:
- a first surface substantially level with a top surface of the photonic integrated circuit;
- a second surface opposite the first surface;
- and
- a plurality of conductive vias extending from the first surface to the second surface.
Dependencies are inferred from the claim text.