Semiconductor package with leadframe interconnection structure

A method of manufacturing a semiconductor package, the method comprising:

• providing a leadframe comprising leads and a plurality of die pads;
• partly encasing the leadframe in a mold compound so that the leads protrude from the mold compound and at least two of the plurality of die pads have a surface at a first side of the leadframe which is not covered by the mold compound;
• attaching a laser module to the surface of the at least two die pads which is not covered by the mold compound, the laser module configured to emit laser light outward from the semiconductor package;
• and
• attaching a driver die to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module,
• wherein the driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and the driver die to the leadframe.