Package structure and method for fabricating the same

A package structure, comprising:

• a lead frame having a die attach pad and a plurality of leads;
• an electronic component disposed on the die attach pad and having a sensing surface;
• at least one conductive element disposed on the leads, wherein the conductive element is a bonding wire segment or a loop-type bonding wire;
• an encapsulant formed on the lead frame and encapsulating the electronic component and the conductive element, with the sensing surface of the electronic component and a portion of a surface of the conductive element exposed from the encapsulant;
• and
• a conductive layer formed on the encapsulant and electrically connecting the conductive element and the electronic component.