Lid for semiconductor electronic package

A method, comprising:

• mounting a metallic component to a semiconductor electronic package, the semiconductor electronic package including a first electronic component and a plurality of second electronic components that are of a type different than the first electronic component, wherein the first electronic component is covered by the metallic component, wherein the first electronic component and the plurality of second electronic components are mounted along a surface of a substrate of the semiconductor electronic package, wherein the first electronic component is spaced apart along the surface of the substrate from the plurality of second electronic components, and wherein the plurality of second electronic components are exposed through an aperture of the metallic component;
• coupling a first heat sink to the metallic component to dissipate heat generated by the first electronic component away from the first electronic component;
• and
• coupling a second heat sink, mechanically and thermally separate from both the first heat sink and the metallic component, to the plurality of second electronic components to dissipate heat generated by the plurality of second electronic components away from the plurality of second electronic components.

A semiconductor electronic package, comprising:

• a first electronic component that is of a first type;
• a plurality of second electronic components that are of a second type different than the first type, wherein the plurality of second electronic components are mounted along a surface of a substrate and are spaced apart along the surface of the substrate from the first electronic component;
• a metallic component that is positioned over the first electronic component and that has an aperture through which the plurality of second electronic components are exposed;
• a first heat sink coupled to the metallic component to dissipate heat generated by the first electronic component away from the first electronic component;
• and
• a second heat sink, mechanically and thermally separate from both the first heat sink and the metallic component, coupled to the plurality of second electronic components to dissipate heat generated by the plurality of second electronic components away from the plurality of second electronic components.