Air-cavity semiconductor package with low cost high thermal carrier

An apparatus comprising:

• a thermal carrier comprising a carrier body, a heat slug, a top coating layer, and a bottom coating layer, wherein:
• the heat slug resides in the carrier body and is surrounded by the carrier body;
• the top coating layer fully covers a top surface of the heat slug, and partially covers a top surface of the carrier body, such that periphery portions of the top surface of the carrier body are not covered by the top coating layer;
• and
• the bottom coating layer is formed underneath a bottom surface of the carrier body and a bottom surface of the heat slug;
• a ring structure residing over the thermal carrier and comprising a ring body with an interior opening, wherein:
• a bottom surface of the ring body is coupled to the uncovered periphery portions of the top surface of the carrier body;
• a portion of the top surface of the thermal carrier is exposed through the interior opening of the ring body;
• and
• the heat slug within the thermal carrier is aligned vertically with the interior opening of the ring body;
• a package lid residing on the ring structure and having a recess conjoined with the interior opening of the ring body to form an enclosed cavity;
• and
• at least one semiconductor device attached to the exposed portion of the top surface of the thermal carrier and encapsulated in the enclosed cavity.