Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same

A semiconductor assembly, comprising:

• a substrate;
• a graphics processing unit (GPU) mounted on the substrate;
• a memory device mounted above and overlapping the logic device;
• a thermal-insulator interposer disposed between the GPU and the memory device and,
• wherein the thermal-insulator interposer is configured to reduce vertical transfer of thermal energy between the GPU and the memory device;
• and
• a vertically extending connector electrically coupling the memory device and the GPU,
• wherein the vertically extending connector extends vertically across the thermal-insulator interposer.

A method of manufacturing a semiconductor package, the method comprising:

• providing a substrate;
• mounting a logic device over the substrate;
• providing a graphene layer over the logic device, wherein:
• the graphene layer is configured to transfer thermal energy from the logic device across a horizontal plane, and
• the graphene layer includes a hole;
• attaching a thermal-insulator interposer over the graphene layer, wherein the thermal-insulator interposer includes an opening;
• and
• attaching a memory device over the thermal-insulator interposer and overlapping the logic device, wherein attaching the memory device includes connecting a vertically extending connector between the memory device and the logic device, the vertically extending connector extending vertically through the hole and the opening.