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US 10,872,834 B2Granted
Integrated circuit structures with extended conductive pathways
AssigneeIntel Corporation
InventorYen Hsiang Chew
Life of this patent
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Abstract
Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.
Claims20
An integrated circuit (IC) structure, comprising:
- a first component, including:
- a first die having a device side and an opposing back side,
- a dielectric material at the back side, and
- a conductive pathway extending into the first die from the back side and extending into the dielectric material from the back side;
- and
- a second component conductively coupled to the first component, wherein the second component includes a second die, and the conductive pathway is located in a volume between the second die and the first die.
3 more elements
An integrated circuit (IC) structure, comprising:
- a first component, including:
- a first die having a device side and an opposing back side,
- a dielectric material at the back side, and
- a conductive pathway extending into the die from the back side and extending into the dielectric material from the back side,
- a first conductive contact structure in a footprint of the first die, wherein the first conductive contact structures includes at least part of the conductive pathway, and
- a second conductive contact structure, coplanar with the first conductive contact structure, outside the footprint of the die;
- and
- a second component conductively coupled to the first component, wherein the second component is conductively coupled to the first conductive contact structure and the second conductive contact structure, the second component includes a second die, and the first conductive contact structure is located in a volume between the first die and the second die.
5 more elements
An integrated circuit (IC) structure, comprising:
- a first component, including:
- a first die having a device side and an opposing back side,
- a dielectric material at the back side, and
- a conductive pathway extending into the first die from the back side and extending into the dielectric material from the back side;
- a second component conductively coupled to the conductive pathway of the first component, wherein the second component includes a second die;
- a third component, conductively coupled to the second component, wherein the second component is at least partially located in a volume between the second component and the first component;
- a package substrate;
- and
- first-level interconnects coupling the device side of the die to the package substrate.
6 more elements
Dependencies are inferred from the claim text.