Method of forming a semiconductor package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYing-Shin Han, Yen-Miao Lin, Chung-Chih Chen, Hsien-Liang Meng
Life of this patent
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Abstract
A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid.
Claims20
A method of forming a semiconductor package, comprising:
- dispensing inner and an outer adhesive rings on a substrate having an integrated circuit die attached thereon, wherein the inner adhesive ring is between the integrated circuit die and the outer adhesive ring;
- placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the inner adhesive ring and at least a portion of the outer adhesive ring;
- and
- pressing the lid against the substrate such that the inner and outer adhesive rings are squeezed from a space between the bottom surface of the lid and the substrate onto an inner and an outer sidewall of the lid, respectively, wherein the inner adhesive ring on the inner sidewall of the lid is higher than the outer adhesive ring on the outer sidewall of the lid.
A method of forming a semiconductor package, comprising:
- attaching an integrated circuit die on a substrate;
- dispensing an inner adhesive portion and an outer adhesive portion on the substrate;
- and
- pressing a foot portion of a lid against the inner adhesive portion and the outer adhesive portion such that the inner adhesive portion and the outer adhesive portion are merged together, a portion of the inner adhesive portion is squeezed onto an inner sidewall of the foot portion, and a portion of the outer adhesive portion is squeezed onto an outer sidewall of the foot portion, wherein the portion of the inner adhesive portion on the inner sidewall is higher than the portion of the outer adhesive portion on the outer sidewall.
A method of forming a semiconductor package, comprising:
- attaching an integrated circuit die on a substrate;
- dispensing a first adhesive on the integrated circuit die;
- dispensing a second adhesive on the substrate;
- and
- pressing a foot portion of a lid against the first and second adhesives such that a first portion of the second adhesive on an inner sidewall of the foot portion is higher than a second portion of the second adhesive on an outer sidewall of the foot portion and is lower than the first adhesive.
Dependencies are inferred from the claim text.