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US 10,872,801 B2Granted
Target substrate with micro semiconductor structures
AssigneeUltra Display Technology Corp.
InventorHsien-Te Chen
Life of this patent
Estimating the term…
Abstract
A target substrate with micro semiconductor structures is manufactured by following steps of: attaching a pre-adhesive layer on a target substrate; patterning the adhesive layer to form a plurality of micro contact protrusions; and using the target substrate to perform a selective batch pickup procedure to pick up a plurality of micro semiconductor structures so as to form the target substrate with micro semiconductor structures.
Claims20
A target substrate with micro semiconductor structures, comprising:
- a target substrate having a substrate body and a plurality of conductive portions disposed on the substrate body;
- a plurality of micro semiconductor structures patternedly disposed on the target substrate, wherein each of the micro semiconductor structures comprises a main body and at least a pair of electrodes disposed on the main body, and each of the electrodes is directly contacted and eutectic bonded with corresponding one of the conductive portions of the target substrate excluding a solder between the electrode and the conductive portion;
- and
- a plurality of micro contact protrusions connecting the main bodies of the patterned micro semiconductor structures to the substrate body of the target substrate, wherein with respect to the pair of the electrodes of one of the micro semiconductor structures, a zone is between the pair of the electrodes, at least one part of the micro contact protrusions is beyond the zone and at a periphery of the pair of the electrodes;
- wherein each of the micro semiconductor structures is a single structure excluding semiconductor package.
2 more elements
A target substrate with micro semiconductor structures, comprising:
- a target substrate;
- a plurality of micro semiconductor structures disposed on the target substrate;
- and
- a first connecting element and a second connecting element connecting the micro semiconductor structures to the target substrate;
- wherein the target substrate has a substrate body and a plurality of conductive portions disposed on the substrate body, and each of the micro semiconductor structures comprises a main body and at least a pair of electrodes disposed on the main body;
- wherein the first connecting element excludes a solder and is formed from directly connecting and eutectic bonding the electrode of each of the micro semiconductor structures with corresponding one of the conductive portions of the target substrate;
- and
- wherein the second connecting element connects the main bodies of the micro semiconductor structures to the substrate body of the target substrate, and the second connecting element is formed by at least a micro contact protrusion, wherein with respect to the pair of the electrodes of one of the micro semiconductor structures, a zone is between the pair of the electrodes, at least one part of the second connecting element is beyond the zone and at a periphery of the pair of the electrodes;
- wherein each of the micro semiconductor structures is a single structure excluding semiconductor package.
6 more elements
Dependencies are inferred from the claim text.