Automatic in-line inspection system

An inspection station for inline detection of defects on a semiconductor wafer surface, the inspection station coupled to a first processing station, the inspection station comprising:

• a conveyor configured to transport the semiconductor wafer from the first processing station to the inspection station;
• a camera configured to scan a surface of the semiconductor wafer and generate at least one image of the surface;
• and
• at least one processor configured to receive the at least one image from the camera and analyze the at least one image to detect defects on the surface based on a set of pre-determined criteria,
• wherein the conveyor is further configured to automatically transport the wafer from the inspection station to either the second processing station if the wafer is determined to be not defective or a stocker if the wafer is determined to be defective.

A system for inline detection of defects on a semiconductor wafer surface during a semiconductor device manufacturing process, the system comprising:

• a first processing station for performing a first semiconductor manufacturing process;
• a second processing station for performing a second semiconductor manufacturing process;
• an inspection station coupled between the first and the second processing station for transporting a semiconductor wafer between the first and the second processing stations, wherein the inspection station comprises:
• a conveyor configured to automatically transport the semiconductor wafer from the first processing station to the inspection station;
• a reflective mirror to redirect an optical pathway between the camera and the wafer surface, wherein the reflective mirror has a surface corrugation level and a surface curvature, wherein the surface corrugation level is equal to or smaller than 20 μm/20 mm and the surface curvature is equal to or smaller than 0.1 mm/100 mm;
• a camera configured to scan a surface of the semiconductor wafer and generate at least one image of the surface;
• and
• at least one processor configured to receive the at least one image from the camera and analyze the at least one image to detect defects on the surface based on a set of pre-determined criteria,
• wherein the conveyor is further configured to automatically transport the wafer from the inspection station to either the second processing station if the wafer is determined to be not defective or a stocker if the wafer is determined to be defective.