Measurement device and semiconductor manufacturing system including the same

A measurement device comprising:

• an emitter configured to emit an electromagnetic signal to an object to be measured;
• a first detector spaced apart from the emitter with the object to be measured disposed therebetween;
• and
• a second detector spaced apart from the first detector with the object to be measured disposed therebetween, the second detector being adjacent to the emitter,
• wherein the emitter is configured to emit the electromagnetic signal in a direction substantially perpendicular to a surface of the object to be measured,
• wherein the object to be measured has a first measurement surface adjacent to the emitter and a second measurement surface opposite to the first measurement surface,
• wherein the first detector is further configured to measure a first time difference defined as a difference between a time taken for a first portion of the electromagnetic signal to be reflected by the first measurement surface and reach the first detector and a time taken for the first portion of the electromagnetic signal to be reflected by the second measurement surface and reach the first detector, and
• wherein the second detector is further configured to measure a second time difference defined as a difference between a time taken for a second portion of the electromagnetic signal to be transmitted by a mold and a package substrate and reach the second detector and a time taken for the second portion of the electromagnetic signal to be transmitted by the package substrate and reach the second detector.

A semiconductor package manufacturing system comprising:

• a package mounter configured to manufacture a semiconductor package including a package substrate, a semiconductor chip, and a mold;
• a mold measurement device configured to measure a refractive index and a thickness of the mold;
• and
• a transporter configured to transfer the semiconductor package to the mold measurement device,
• wherein the package mounter comprises:
• a package mounting station configured to mount the semiconductor chip on the package substrate and provide the mold to cover the semiconductor chip;
• and
• a manufacturing processor configured to control the package mounting station, and the mold measurement device comprises:
• an emitter configured to emit an electromagnetic signal to the semiconductor package;
• a first detector disposed to measure a first portion of the electromagnetic signal reflected by the semiconductor package;
• a second detector disposed to measure a second portion of the electro magnetic signal transmitted by the semiconductor package;
• and
• a measurement processor configured to calculate the refractive index and the thickness of the mold based on the electromagnetic signal measured by the first and second detectors,
• wherein the emitter is configured to emit the electromagnetic signal in a direction substantially perpendicular to a surface of the semiconductor package,
• wherein the mold has a bottom surface in contact with the package substrate and a top surface opposite the bottom surface,
• wherein the first detector is further configured to measure a first time difference defined as a difference between a time taken by the first portion of the electromagnetic signal reflected by a portion of the top surface to reach the first detector and a time taken by the first portion of the electromagnetic signal reflected by a portion of the bottom surface vertically overlapping the portion of the top surface to reach the first detector, and
• wherein the second detector is further configured to measure a second time difference defined as a difference between a time taken by the second portion of the electromagnetic signal transmitted by the mold and the package substrate to reach the second detector and a time taken by the second portion of the electromagnetic signal transmitted through the package substrate to reach the second detector.