Apparatus for purging semiconductor process chamber slit valve opening

A semiconductor processing chamber comprising:

• a chamber wall that at least partially bounds the semiconductor processing chamber;
• a gas inlet;
• a wafer transfer passage that extends through the chamber wall along a first axis and that includes:
• an inner passage surface that defines an opening perpendicular to the first axis,
• a first recessed surface that extends at least partially around and is outwardly offset from the inner passage surface when viewed along the first axis, and
• a first wall surface that extends between the inner passage surface and the first recessed surface;
• and
• an insert that includes:
• an insert inner surface that defines an insert opening perpendicular to the first axis,
• a first insert outer surface that extends at least partially around and is outwardly offset from the insert inner surface when viewed along the first axis, and
• an insert front surface that extends between the insert inner surface and the first insert outer surface,
• wherein:
• the first recessed surface, the first insert outer surface, and the first wall surface at least partially define a gas distribution channel,
• the gas distribution channel is fluidically connected to the gas inlet,
• the first recessed surface is outwardly offset from the first insert outer surface,
• the insert front surface is offset from the first wall surface along the first axis,
• the insert front surface is oriented at one of:
• a first oblique angle to the first axis, or perpendicular to the first axis, and
• the first wall surface is oriented at one of:
• a second oblique angle to the first axis, or perpendicular to the first axis.