Printed circuit board
AssigneeLG Innotek Co., Ltd.
InventorsSung Oh Cho, Yoon Tai Kim
Life of this patent
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Abstract
A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
Claims18
A printed circuit board comprising:
- an insulating layer;
- a first pad disposed on a first surface of the insulating layer;
- a first conductive layer disposed on the first pad and including gold (Au);
- a second pad disposed on a second surface of the insulating layer;
- and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer includes a first region in contact with the first pad and a second region spaced apart from the first pad, wherein the first region of the first conductive layer and the second region of the first conductive layer are monolithically formed with each other, wherein the second region of the first conductive layer comprises a portion of the first conductive layer that is bent in an outward direction, wherein the second conductive layer includes a first region in contact with the second pad and a second region spaced apart from the second pad, wherein the first region of the second conductive layer and the second region of the second conductive layer are monolithically formed with each other, wherein the second region of the second conductive layer comprises a portion of the second conductive layer that is bent in an outward direction, and wherein the first conductive layer is thicker than the second conductive layer, and wherein the first pad has a narrower width than does the second pad.
A printed circuit board comprising:
- an insulating layer;
- a first pad disposed on a first surface of the insulating layer;
- a second pad disposed on a second surface of the insulating layer opposite to the first surface;
- a first passivation layer disposed on the first surface of the insulating layer and exposing an upper surface of the first pad;
- and a second passivation layer disposed on the second surface of the insulating layer and exposing a lower surface of the second pad;
- and a first conductive layer disposed on the first pad, wherein the first conductive layer includes:
- a first region in direct physical contact with the upper surface of the first pad;
- and a second region extending from the first region and spaced apart from the first pad, wherein the first region of the first conductive layer and the second region of the first conductive layer are monolithically formed with each other, wherein the second passivation layer has an opening partially or completely exposing the lower surface of the second pad, and wherein the first conductive layer includes a third region disposed between the first region and the second region and in direct physical contact with a side surface of the first pad.
Dependencies are inferred from the claim text.