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US 10,872,750 B2Granted
Plasma processing apparatus and plasma processing system
AssigneeHitachi High-Tech Corporation
InventorsRyoji Asakura, Shota Umeda, Daisuke Shiraishi, Akira Kagoshima, Satomi Inoue
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Abstract
The plasma processing apparatus includes a plasma processing unit that performs plasma processing of a sample and a control unit that controls the plasma processing. The control unit selects one of a plurality of the prediction models for predicting a result of the plasma processing based on a state of the plasma processing unit, and predicts the result of the plasma processing by using a selected prediction model.
Claims6
A plasma processing apparatus comprising:
- a plasma processing unit that performs plasma processing of a sample;
- and
- a control unit that controls the plasma processing,
- wherein the control unit selects one of a plurality of prediction models for predicting a result of the plasma processing for each of a plurality of divided data of a management value based on a state of the plasma processing unit, and predicts the result of the plasma processing by using the selected prediction model selected for each said divided data,
- wherein the divided data is data divided based on a threshold of the management value indicating a state of the plasma processing unit.
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Dependencies are inferred from the claim text.