Multilayer ceramic electronic component and interposer included therein

A multilayer ceramic electronic component comprising:

• a ceramic body including dielectric layers and first and second internal electrodes laminated with each of the dielectric layers interposed therebetween and alternately exposed to first and second external surfaces of the ceramic body;
• first and second external electrodes disposed on the first and second external surfaces of the ceramic body to be connected to the first and second internal electrodes, respectively;
• an interposer, including an insulating body, disposed below the ceramic body, and first and second terminal electrodes having an upper portion disposed between the insulating body and the first and second external electrodes and a lower portion disposed on a lower surface of the insulating body, respectively;
• and
• a solder having at least a portion disposed between the upper portion of the first and second terminal electrodes and the first and second external electrodes,
• wherein B, equal to (B1+B2)/2, is greater than or equal to 10 micrometers (μm) and less than or equal to 20 μm, and C is greater than or equal to 55 μm and less than or equal to 80 μm, in which B1 is a thickness of the upper portion of each of the first and second terminal electrodes, B2 is a thickness of the lower portion of each of the first and second terminal electrodes, and C is a thickness of the interposer,
• wherein A is greater than or equal to (100 μm−4.5B) and less than or equal to (100 μm−3.5B), in which A is a thickness of the insulating body, and
• wherein, among the upper portion of each of the first and second terminal electrodes and the lower portion of each of the first and second terminal electrodes, the solder is in contact with only the upper portion of each of the first and second terminal electrodes.