Mounting board manufacturing system and mounting board manufacturing method

A mounting board manufacturing method comprising:

• a component placing step of placing a component on a board by a component placer including a placing head having a holding tool that holds the component and places the component on the board, and a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board;
• a state detecting step of detecting a state of the component placer and outputting numerical data indicating the state of the component placer;
• an inspecting step of inspecting a placement position of the component placed on the board by imaging the board on which the component is placed in the component placing step;
• a correction value calculating step of calculating a correction value for correcting the target position using an inspection result obtained in the inspecting step, and updating the correction value using a new inspection result when the new inspection result is obtained;
• and
• a correction value changing step of changing a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value based on a result of comparing a current numerical data obtained during the state detecting step when the operation of the component placer is resumed with at least one piece of past numerical data outputted during the state detecting step.

A mounting board manufacturing system comprising:

• a component placer including;
• a placing head having a holding tool that holds a component and places the component on a board,
• a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board, and
• a state detector that detects a state of the component placer and outputs numerical data indicating the state of the component placer, wherein the state detector includes one of;
• a camera that moves by the placing head mover, at least one reference point fixed to a frame to which the component placer is attached, and an image recognizer that outputs a position of the at least one reference point in the component placer based on an image of the at least one reference point imaged by the camera as the numerical data indicating the state of the component placer, wherein the numerical data indicating the state of the component placer represents the position of the at least one reference point in the component placer outputted by the image recognizer, or
• a temperature measurer that measures a temperature of at least one representative point of the component placer, and outputs the measured temperature as the numerical data indicating the state of the component placer;
• an inspector that inspects a placement position of the component placed on the board by imaging the board on which the component is placed by the component placer;
• a correction value calculator that calculates a correction value for correcting the target position using an inspection result obtained by the inspector, and updates the correction value using a new inspection result when the new inspection result is obtained;
• and
• a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value based on a result of comparing a current numerical data obtained by the state detector when the operation of the component placer is resumed with at least one piece of past numerical data outputted from the state detector.