Display substrate, display panel, display device and bonding method

A display panel, comprising:

• a first transparent substrate and a second transparent substrate facing each other, wherein the first transparent substrate is located at a light-emitting side of the display panel;
• each of the first and second transparent substrates comprises a display area;
• a touch electrode is arranged in the display area of the first transparent substrate;
• a display electrode is arranged in the display area of the second transparent substrate;
• a via hole is formed in the first transparent substrate;
• wherein,
• the first transparent substrate is further provided with a bonding area located at the periphery of the display area, wherein a first bonding pad is connected to the touch electrode through a lead, a second bonding pad is connected to the display electrode, and both bonding pads are arranged in the bonding area;
• the via hole is configured to connect the second bonding pad and the display electrode, and the first bonding pad and the touch electrode are located on a same surface of the first transparent substrate;
• or,
• the second transparent substrate is further provided with a bonding area located at the periphery of the display area, wherein a first bonding pad is connected to the touch electrode, a second bonding pad is connected to the display electrode, and both bonding pads are arranged in the bonding area;
• and the via hole is configured to connect the first bonding pad and the touch electrode.

A bonding method, comprising:

• providing a display panel comprising a first transparent substrate and a second transparent substrate facing each other, wherein the first transparent substrate is located at the light-emitting side of the display panel;
• each of the first and second transparent substrates comprises a display area;
• a touch electrode is arranged in the display area of the first transparent substrate;
• a display electrode is arranged in the display area of the second transparent substrate;
• wherein,
• the first transparent substrate is further provided with a bonding area located at the periphery of the display area, wherein a first bonding pad and a second bonding pad are arranged in the bonding area;
• the first bonding pad is connected to the touch electrode through a lead, the second bonding pad is connected to the display electrode, and the first bonding pad and the touch electrode are located on a same surface of the first transparent substrate;
• the method further comprises:
• forming a via hole in the first transparent substrate;
• connecting the second bonding pad and the display electrode through the via hole;
• and
• bonding the first and second bonding pads to a flexible printed circuit simultaneously,
• or,
• the second transparent substrate is further provided with a bonding area located at the periphery of the display area;
• a first bonding pad and a second bonding pad are arranged in the bonding area, the first bonding pad is connected to the touch electrode, the second bonding pad is connected to the display electrode;
• the method further comprises:
• forming a via hole in the first transparent substrate;
• connecting the first bonding pad and the touch electrode through the via hole;
• bonding the first and the second bonding pads to a flexible printed circuit simultaneously.