Semiconductor device handler with chuck clamp interlock

A system, comprising:

• a chuck apparatus, including a base, and a clip mounted to the base;
• a position control system configured to control a position of the chuck apparatus;
• a contactor with conductive probes to connect to an electronic device under test (DUT);
• and
• an electronic test circuit connected to the contactor to test the DUT;
• the clip being pivotal about a first pivot axis between a first clip position and a second clip position, the clip including an abutment surface spaced apart from the first pivot axis and spaced apart from a path of a carrier structure when the clip is in the first clip position, the abutment surface is positioned to engage the carrier structure to secure the carrier structure and an installed device under test (DUT) to the chuck apparatus when the clip is in the second clip position;
• the chuck apparatus including:
• a cam mounted to the base and pivotal about a second pivot axis between a first cam position and a second cam position, the cam including a first surface that engages the clip to pivot the clip to the first clip position when the cam is in the first cam position, and a second surface that extends into an opening of the base when the cam is in the first cam position,
• a first spring connected between the base and the cam to bias the cam toward the first cam position, and
• a second spring connected between the base and the clip to bias the clip toward the second clip position.

A method, comprising:

• installing a stop plate in a chuck apparatus, including translating a pin of the stop plate into an opening of a base of the chuck apparatus to rotate a cam from a first cam position to a second cam position to allow a spring to rotate a clip from a first clip position to a second clip position;
• translating the chuck apparatus in a first direction toward a carrier structure to engage a tapered surface of the clip with the carrier structure to pivot the clip from the second clip position toward the first clip position;
• continuing translation of the chuck apparatus in the first direction to pivot the clip outward against a bias of the spring until the carrier structure clears an abutment surface of the clip;
• and
• pivoting the clip back to the second clip position using the spring after the carrier structure clears the abutment surface of the carrier structure to engage a step feature of the clip with the abutment surface to engage a thermal interface and the stop plate with a device under test (DUT) installed in the carrier structure.