Inspection method and apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Pin Chou, Yu-Liang Tseng
Life of this patent
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Abstract
A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
Claims20
A method, comprising:
- generating a primary radiation beam from a radiation source;
- splitting the primary radiation beam into a first radiation beam and a second radiation beam such that the first radiation beam and the second radiation beam propagate in opposite directions;
- directing the first radiation beam onto a front side of a wafer;
- directing the second radiation beam onto a back side of the wafer;
- generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer;
- and
- generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
A method, comprising:
- transferring a wafer into an inspection apparatus;
- directing a first radiation beam to a front side of the wafer and a second radiation beam to a backside of the wafer, wherein the first radiation beam directed onto the front side of the wafer is substantially aligned with the second radiation beam directed onto the back side of the wafer;
- generating a first image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer;
- generating a second image of a back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer, wherein generating the first and second images are performed simultaneously;
- generating a third image of an edge of the wafer;
- and
- unloading the wafer from the inspection apparatus.
An apparatus, comprising:
- a plurality of wafer supporters defining a wafer occupiable zone thereon;
- a radiation source aimed at the wafer occupiable zone;
- a beam splitter between the radiation source and the wafer occupiable zone;
- a first reflector assembly optically coupling the beam splitter to a front side of the wafer occupiable zone;
- a second reflector assembly optically coupling the beam splitter to a back side of the wafer occupiable zone;
- a first optical detector optically coupled to the front side of the wafer occupiable zone;
- a second optical detector optically coupled to the back side of the wafer occupiable zone;
- and
- an edge inspection device having a center of curvature substantially level with the beam splitter.
Dependencies are inferred from the claim text.