Aluminum-copper connector having a heterostructure, and method for producing the heterostructure

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminum or an aluminum alloy with solid solutions present in the alloy, wherein

• a. an anchoring layer is arranged between the first and second surfaces, wherein
• b. each slice plane running perpendicular to the anchoring layer has at least one aluminum or aluminum-alloy island surrounded by copper,
• c. any aluminum alloy solid solutions present in the alloy are in the anchoring layer,
• d. the islands of aluminum or aluminum alloy enclosed by copper have nested and sideways protruding cantilevered structure,
• e. if the heterostructure is made of copper and pure aluminum, there are no mixed crystals at all, and
• if the heterostructure is made of copper and aluminum alloy, any mixed crystals present in the heterostructure were pre-existing in the alloy prior to forming the heterostructure and the forming of the heterostructure has not formed any new solid solution crystals, and
• f. the thickness of the anchoring layer is between 0.5 and 100 micrometers.