Processing device, sputtering device, and collimator

A film forming device comprising:

• an object placement unit configured to have an object placed thereon;
• a source placement unit arranged apart from the object placement unit and configured to have a particle source placed thereon, the particle source being capable of ejecting a particle toward the object;
• a cryopump including a collimator and a temperature adjusting unit,
• the collimator configured to be arranged between the object placement unit and the source placement unit, including a plurality of walls, and provided with a plurality of through holes formed by the plurality of walls and extending a direction from the object placement unit to the source placement unit, and
• the temperature adjusting unit configured to decrease a temperature of the collimator to a temperature at which air is attached to surfaces of the walls;
• and
• a container including an airtightly closable processing chamber, wherein
• the object placement unit, the source placement unit, and the collimator are configured to be arranged in the processing chamber,
• and
• the cryopump is configured to cause the air in the processing chamber to be attached to the surfaces of the walls to make the processing chamber vacuum.