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US 10,870,756 B2Granted
Acrylic composition for encapsulation, sheet material, laminated sheet, cured object, semiconductor device, and process for producing semiconductor device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsShigeru Yamatsu, Kazuki Watanabe, Naoki Kanagawa, Daisuke Sasaki
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Abstract
The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator.
Claims25
An acrylic composition for sealing, the acrylic composition comprising:
- an acrylic compound;
- a polyphenylene ether resin including a radical-polymerizable substituent at a terminal;
- maleic acid-modified polybutadiene;
- an inorganic filler;
- and
- a thermal radical polymerization initiator, wherein:
- the acrylic compound contains a (meth)acrylate having a crosslinked polycyclic structure, a di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton, and an epoxy (meth)acrylate,
- a proportion of the (meth)acrylate having a crosslinked polycyclic structure in the acrylic compound ranges from 10% by mass to 50% by mass, inclusive,
- a proportion of the di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton in the acrylic compound ranges from 3% by mass to 20% by mass, inclusive, and
- a proportion of the epoxy (meth)acrylate in the acrylic compound ranges from 5% by mass to 30% by mass, inclusive.
7 more elements
A method for manufacturing a semiconductor device, the method comprising:
- overlaying a sheet material on a surface of a semiconductor wafer including a bump electrode, the surface including the bump electrode, the sheet material being a dried product or a half-cured product of an acrylic composition for sealing, the acrylic composition comprising
- an acrylic compound,
- a polyphenylene ether resin including a radical-polymerizable substituent at a terminal,
- an inorganic filler, and
- a thermal radical polymerization initiator;
- cutting the semiconductor wafer together with the sheet material to produce a member, the member including a semiconductor chip cut out from the semiconductor wafer and an individual sheet cut out from the sheet material;
- stacking a substrate including a conductor wiring, the individual sheet, and the semiconductor chip in this order by overlaying the member on a surface of the substrate, the surface including the conductor wiring;
- and
- heating the individual sheet to produce a sealing material by melting and then curing the individual sheet, and to electrically connect the bump electrode to the conductor wiring.
6 more elements
A sheet material that is a dried product or a half-cured product of an acrylic composition for sealing, the acrylic composition including:
- an acrylic compound;
- a polyphenylene ether resin including a radical-polymerizable substituent at a terminal;
- an inorganic filler;
- and
- a thermal radical polymerization initiator, wherein:
- the acrylic compound contains a (meth)acrylate having a crosslinked polycyclic structure, a di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton, and an epoxy (meth)acrylate,
- a proportion of the (meth)acrylate having a crosslinked polycyclic structure in the acrylic compound ranges from 10% by mass to 50% by mass, inclusive,
- a proportion of the di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton in the acrylic compound ranges from 3% by mass to 20% by mass, inclusive,
- a proportion of the epoxy (meth)acrylate in the acrylic compound ranges from 5% by mass to 30% by mass, inclusive, and
- the sheet material has a minimum melt viscosity less than or equal to 200 Pa·s.
7 more elements
Dependencies are inferred from the claim text.