Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board

A polyphenylene ether resin composition comprising

• (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and
• (B) a crosslinking agent having a carbon-carbon unsaturated double bond, wherein the crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene,
• components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A) :
• (B), of from 65:35 to 95:5,
• components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1) :
• (B-2), of from 1:100 to 1.5:1, and
• the (B-2) polybutadiene comprises at least one selected from the group consisting of 1,4-polybutadiene and 1,2-polybutadiene.