Method and device for transferring a decorating segment of an embossing film

A method for transferring a decorative section of a stamping foil onto a substrate by means of an embossing die, wherein the stamping foil comprises a carrier film and a transfer ply arranged on the carrier film, the method comprising:

• a) Provision of the stamping foil;
• b) Forming a predetermined mechanically loaded breaking point at a defined position in the transfer ply of the stamping foil by embossing or pressing of at least one compression section, spaced apart from an edge of the decorative section, into the transfer ply, the predefined mechanically loaded breaking point facilitating breaking of the transfer ply when subjected to bending stress;
• c) Stamping of the decorative section from the stamping foil onto the substrate, wherein the decorative section is embossed and transferred to the substrate such that remaining portions of the stamping foil not transferred form a residual stamping film;
• d) Detachment of the residual stamping film from the substrate embossed with the decorative section by exerting a bending stress at the predefined mechanically loaded breaking point,
• wherein, during said embossing or pressing, a pressing pressure pk is applied, which is greater than a stamping pressure pp applied during said stamping.