Heat sinks with vibration enhanced heat transfer for non-liquid heat sources
AssigneeUnited Arab Emirates University
InventorsSalah Addin Burhan Al Omari, Emad Elnajjar
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AssigneeUnited Arab Emirates University
InventorsSalah Addin Burhan Al Omari, Emad Elnajjar
Estimating the term…
The heat sinks with vibration enhanced heat transfer for non-liquid heat sources are heat sinks formed from a first body of high thermal conductivity material received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be any non-liquid heat source, including a processor chip, an integrated circuit chip, a modular circuit package, or the like. The thermally conductive housing may be disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. Alternatively, the vibrating base may be attached to a support attached to the heat source. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.
A heat sink with vibration enhanced heat transfer for non-liquid heat sources, comprising:
Dependencies are inferred from the claim text.