Heat-insulation box
AssigneePanasonic Corporation
InventorsToru Okazaki, Baiyu Liu, Terutsugu Segawa, Yasuhiro Asaida
Life of this patent
Estimating the term…
Loading patent…
AssigneePanasonic Corporation
InventorsToru Okazaki, Baiyu Liu, Terutsugu Segawa, Yasuhiro Asaida
Estimating the term…
A heat-insulation box, includes: a heat-insulation-box main body that has a space; a door that seals the space; and a partition plate that partitions the space, wherein the partition plate includes (i) a design plate that is placed at a side of the door, (ii) a first plate part and a second plate part that are each provided at both edges of the design plate, (iii) a heat-insulation material that is located in a region surrounded by the design plate, the first plate part, and the second plate part, and (iv) a heat-insulation member that is placed in at least one of a gap between the design plate and the first plate part, and a gap between the design plate and the second plate part.
A heat-insulation box, comprising:
A heat-insulation box, comprising:
Dependencies are inferred from the claim text.