Plating apparatus and plating method

A plating method, comprising:

• providing an anode electrode and a substrate to be plated in a plating bath containing a plating solution;
• providing a fluid stirring member in the plating bath and between the anode electrode and the substrate to be plated, wherein the fluid stirring member comprises a plurality of first stirring stripes extending along a first direction parallel to a plating surface of the substrate to be plated and a plurality of second stirring stripes extending along a second direction and intersected with the plurality of first stirring stripes and parallel to the plating surface;
• when a first plating process is performed, moving the fluid stirring member to reciprocate along the second direction so the plating solution flows through and is stirred by the first stirring stripes with smooth contact surfaces;
• and
• when a second plating process is performed, moving the fluid stirring member to reciprocate along the first direction so the plating solution flows through and is stirred by the second stirring stripes with rough contact surfaces.