Plating method and plating apparatus

A plating method for plating a substrate having resist opening portions including:

• a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying a first process liquid to a surface of the substrate on which the resist opening portions are formed;
• a liquid filling step of soaking the substrate passed through the removing step in a second process liquid to fill the resist opening portions of the substrate with the second process liquid;
• and
• a plating step of plating the substrate passed through the liquid filling step, wherein
• the resist residue removing step includes a step of scanning the substrate with nozzles,
• the nozzles include a first nozzle group and a second nozzle group that are spaced from each other in upper and lower positions in a vertical direction, and
• the resist residue removing step includes a step of performing spraying from the first nozzle group and spraying from the second nozzle group to the substrate arranged in the vertical direction at different timings.