Back to results
US 10,865,471 B2Granted
Cylindrical compact, manufacturing method of cylindrical sputtering target, and manufacturing method of cylindrical sintered compact
AssigneeJX Nippon Mining & Metals Corporation
InventorYohei Yamaguchi
Life of this patent
Estimating the term…
Abstract
A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a difference therebetween in the relative density of 0.1% or smaller.
Claims3
A manufacturing method of a cylindrical sputtering target, comprising:
- sintering a plurality of cylindrical compacts having a relative density of 55.0% or higher and 58.0% or lower and containing ITO or IGZO to form a plurality of cylindrical sintered compacts having a relative density of 99.7% or higher and 99.9% or lower;
- and
- locating the plurality of cylindrical sintered compacts to be adjacent to each other having a difference therebetween in the relative density of 0.1% or smaller,
- wherein the relative densities of the plurality of cylindrical sintered compacts are different from each other.
1 more element
Dependencies are inferred from the claim text.