Adhesive film for semiconductor
AssigneeLG Chem, Ltd.
InventorsHee Jung Kim, Se Ra Kim, Jung Hak Kim, Seung Hee Nam, Jung Ho Jo, Kwang Joo Lee, Young Kook Kim
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Abstract
The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.
Claims16
An adhesive film for a semiconductor having a melt viscosity of 1,000 Pa·s to 4,000 Pa·s at a temperature of 110° C. and a shear rate of 5 rad/s, and a modulus generated at 5% to 10% elongation at room temperature of 75 MPa to 300 MPa,
- wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
- wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, and
- wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600.
An adhesive film for a semiconductor having a melt viscosity of 1,000 Pa·s to 4,000 Pa·s at a temperature of 110° C. and a shear rate of 5 rad/s, and elongation at room temperature of 500% or less,
- wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
- wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6,
- wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600, and
- wherein a modulus generated at 5% to 10% elongation at room temperature is 75 MPa to 300 MPa.
An adhesive film for a semiconductor having a modulus generated at 5% to 10% elongation at room temperature of 75 MPa to 300 MPa, and elongation at room temperature of 500% or less,
- wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
- wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, and
- wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600.
An adhesive film for a semiconductor having a melt viscosity of 1,000 Pa·s to 4,000 Pa·s at a temperature of 110° C. and a shear rate of 5 rad/s, a modulus generated at 5% to 10% elongation at room temperature of 75 MPa to 300 MPa, and elongation at room temperature of 500% or less,
- wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
- wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, and
- wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600.
Dependencies are inferred from the claim text.