US 10,865,272 B2 · Thermosetting resin composition

Abstract

A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition includes: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure and/or (b) a polyvalent amine-based curing agent (component b).

Claims14

Dependent claims

A thermosetting resin composition comprising:

(A) an epoxy resin (component A);
(B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure:
wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group or a combination of these groups, and may contain a hetero atom or substituent;
and
(b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i):
wherein Ar1 to Ar4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent.

3 more elements

Dependencies are inferred from the claim text.

Thermosetting resin composition

Life of this patent

Thermosetting resin composition

Life of this patent

Abstract

Claims14