Heat conductive sheet and method for producing heat conductive sheet
AssigneeDexerials Corporation
InventorMasayuki Matsushima
Life of this patent
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Abstract
A heat conductive sheet having excellent adhesion between an acrylic resin layer and a supporting sheet is provided. The heat conductive sheet includes a heat conductive resin layer including a heat conductive acrylic resin composition; and a supporting resin layer (supporting sheet) containing a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer. Crosslinking of the supporting sheet with acrylic monomers of the acrylic heat conductive resin layer enables improvements in adhesion between the heat conductive resin layer and the supporting sheet.
Claims14
A heat conductive sheet comprising:
- a heat conductive resin layer comprising a heat conductive acrylic resin composition;
- and
- a supporting resin layer containing a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer, wherein:
- the polyvinyl acetal resin and the styrene-vinyl isoprene block copolymer are blended at a mass ratio from 9:1 to 7:3, and
- a degree of acetalization of the polyvinyl acetal resin is in a range of from 50 to 90 mol % wherein the heat conductive resin layer overlays with the supporting resin layer along a thickness direction of the heat conductive sheet, and at least a portion of an edge of the heat conductive resin layer is in contact with at least a portion of an edge of the supporting resin layer.
A method for manufacturing a heat conductive sheet comprising the steps of:
- forming a supporting resin layer by mixing and sheet-forming a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer;
- and
- forming a heat conductive resin layer by curing a heat conductive acrylic resin composition in a state of contact with the supporting resin layer, wherein:
- the polyvinyl acetal resin and the styrene-vinyl isoprene block copolymer are blended at a mass ratio from 9:1 to 7:3, and
- a degree of acetalization of the polyvinyl acetal resin is in a range of from 50 to 90 mol % wherein the heat conductive resin layer overlays with the supporting resin layer along a thickness direction of the heat conductive sheet, and at least a portion of an edge of the heat conductive resin layer is in contact with at least a portion of an edge of the supporting resin layer.
Dependencies are inferred from the claim text.