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US 10,864,612 B2Granted
Polishing pad and method of using
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChunHung Chen, Jung-Yu Li, Sheng-Chen Wang, Shih-Sian Huang
Life of this patent
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Abstract
A polishing pad includes a first region having a first geometric property and a first material property. The polishing pad further includes a second region having a second geometric property and a second material property, wherein the second region is closer to an edge of the polishing pad than the first region. The first geometric property is different from the second geometric property; or the first material property is different from the second material property.
Claims18
A polishing pad comprising:
- a first region having a first material property, wherein the first region comprises a first plurality of grooves, and each groove of the first plurality of grooves has a first depth;
- a second region having a second material property, wherein the second region is closer to an edge of the polishing pad than the first region, the second region comprises a second plurality of grooves, and each groove of the second plurality of grooves has a second depth less than the first depth;
- and
- the first material property of the first region varies in a thickness direction of the polishing pad, the thickness direction is perpendicular to a direction from the first region to the second region, each of the first plurality of grooves extends through at least two variations in the first material property, and the first material property comprises porosity, specific gravity or absorbance.
1 more element
A polishing pad comprising:
- a first region having a first plurality of grooves, wherein each groove of the first plurality of grooves has a first groove pitch, a first groove width, and a first groove depth;
- a second region having a second plurality of grooves, wherein each groove of the second plurality of grooves has a second groove pitch, a second groove width and a second groove depth, wherein the first groove pitch is different from the second groove pitch, the first groove width is different from the second groove width, and the first groove depth is different from the second groove depth;
- and
- a specific gravity of the first region varies in a thickness direction of the polishing pad, the thickness direction is perpendicular to a direction from the first region to the second region, a first specific gravity of the first region at a top-most surface of the polishing pad is greater than a second specific gravity of the first region at a bottom-most surface of the polishing pad, and each of the first plurality of grooves extends completely through a portion of the first region having the first specific gravity.
1 more element
Dependencies are inferred from the claim text.