Location of image plane in a laser processing system
AssigneeElectro Scientific Industries, Inc.
InventorsYuan Liu, Honghua Hu, Jim Brookhyser, Guangyu Li, Brandon Bilyeu, Kurt Eaton
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AssigneeElectro Scientific Industries, Inc.
InventorsYuan Liu, Honghua Hu, Jim Brookhyser, Guangyu Li, Brandon Bilyeu, Kurt Eaton
Estimating the term…
Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
A method of processing a workpiece using a laser processing system having a scan lens, the method, comprising:
An apparatus for laser processing a substrate comprising:
A method of processing a workpiece using a laser processing system having a scan lens, the method, comprising:
Dependencies are inferred from the claim text.