Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus

A method for manufacturing an ultrasonic bonding tool, said ultrasonic bonding tool comprising a chip portion at a distal end portion of the tool, the chip portion comprising a surface portion, the surface portion comprising a plurality of planar portions and a plurality of concavities between planar portions of the plurality of planar portions, and the tool being capable of applying ultrasonic vibration, said method for manufacturing the tool comprising:

• preparing a tool original material comprising a distal planar portion with a flatness of more than 2 μm;
• grinding the tool original material to enhance the flatness of the distal planar portion to a flatness of 2 μm or less;
• selectively forming the plurality of concavities by wire cutting or with a cutting wheel, wherein the plurality of concavities separate the distal planar portion into the plurality of planar portions;
• shot-blasting an edge of an outer peripheral portion of planar:
• portions in the plurality of planar portions, thereby rounding the edge;
• and
• shot-blasting to form an uneven shape in each planar portion in the plurality of planar portions so as to maintain a flatness of 2 μm or less in the plurality of planar portions and form an uneven shape with a flatness of 0.2 μm or less in the plurality of concavities.