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US 10,864,551 B2Granted
Compact ultrasound transducer with direct coax attachment
AssigneeKoninklijke Philips N.V.
InventorWojtek Sudol
Life of this patent
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Abstract
An ultrasound device includes a transducer array (404) formed on a first side of a substrate (402). A through via (406) passes through a thickness of the substrate between the first side and a second side, opposite the first side. A conductor (410) is electrically coupled to the through via on the second side to provide signals to and from the transducer array.
Claims17
An ultrasound device, comprising:
- a single substrate comprising a transducer array and microbeamforming circuitry configured to partially beamform signals from the transducer array, the transducer array being on a first side of the single substrate;
- a first through via passing through a thickness of the single substrate between the first side and a second side, opposite the first side;
- a first conductive bump disposed on the second side of the single substrate and electrically coupled to the first through via;
- a second through via passing through the thickness of the single substrate between the first side and the second side;
- a second conductive bump disposed on the second side of the single substrate and electrically coupled to the second through via;
- and
- a coaxial cable comprising:
- a conductor electrically coupled to the first conductive bump on the second side of the single substrate to provide signals to and from the transducer array;
- and
- a shield disposed around the conductor, wherein the shield is electrically coupled to the second conductive bump on the second side of the single substrate to provide an electrical ground.
7 more elements
A method for fabricating an ultrasound device, comprising:
- providing a single substrate comprising microbeamforming circuitry and a transducer array, the transducer array being on a first side of the single substrate, the single substrate including:
- a first through via passing through a thickness of the single substrate between the first side and a second side, opposite the first side;
- a first conductive bump disposed on the second side of the single substrate and electrically coupled to the first through via;
- a second through via passing through the thickness of the single substrate between the first side and the second side;
- a second conductive bump disposed on the second side of the single substrate and electrically coupled to the second through via;
- electrically coupling a conductor of a coaxial cable to the first conductive bump on the second side of the single substrate, the conductor providing signals to and from the transducer array;
- electrically coupling a shield of the coaxial cable to the second conductive bump on the second side of the single substrate such that the shield provides an electrical ground;
- and
- encasing the transducer array and conductor in an ultrasound window.
6 more elements
Dependencies are inferred from the claim text.