System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects

An imaging sensor comprising:

• a pixel array disposed on a first substrate the pixel array comprising a plurality of pixel columns, wherein each of the plurality of pixel columns is divided into a plurality of pixel sub-columns;
• a plurality of supporting circuits disposed on one or more additional substrates the plurality of supporting circuits comprising a plurality of circuit columns corresponding to the plurality of pixel columns, wherein each of the plurality of circuit columns comprises a plurality of circuit sub-columns corresponding the plurality of pixel sub-columns;
• and
• wherein each of the plurality of circuit sub-columns is only connected to one of the plurality of pixel sub-columns;
• wherein each of the plurality of circuit sub-columns has an area, a size, and an aspect ratio, and each of the plurality of pixel sub-columns that corresponds to each one of the circuit sub-columns has an area, a size, and an aspect ratio;
• and
• wherein the plurality of supporting circuits in each of the circuit sub-columns are configured to independently read and process data from a corresponding pixel sub-column, and wherein pixel sub-columns within a same pixel column are read simultaneously as part of a rolling shutter.