Electronic device console with natural draft cooling

An electronic device console, comprising:

• a console body that houses a chip package;
• a duct connected to the console body, wherein an interior volume of the duct is in fluid communication with an interior volume of the console body;
• a first vent at a distal end of the duct that places the interior volume of the duct in fluid communication with an ambient environment outside the electronic device console;
• and
• a second vent in a wall at a lateral side of the console body that places the interior volume of the console body in fluid communication with the ambient environment;
• at least one additional vent at a front side of the console body;
• wherein the electronic device console is structured and arranged to be oriented in a first orientation and a second orientation;
• the chip package is cooled via natural convection cooling without using a fan that is inside or attached to the electronic device console;
• the duct provides a first chimney effect to the natural convection cooling of the chip package when the electronic device console is oriented in the first orientation;
• the console body provides a second chimney effect to the natural convection cooling of the chip package when the electronic device console is oriented in the second orientation;
• the electronic device console comprises a plurality of feet structured and arranged to support the electronic device console on a bottom surface and another lateral side in the first orientation and the second orientation;
• and
• the electronic device further comprises a slide mechanism positioned at a top of the console body and which allows translational movement of the duct relative to the console body when the electronic device console is oriented in the first orientation such that a proximate end of the duct is moveable into the console body through the slide mechanism,
• wherein
• the first vent, the second vent, and the at least one additional vent comprises an opening that has an adjustable size, and
• the chip package comprises:
• a printed circuit board (PCB) which is coupled to a substrate through electrically conductive leads,
• the substrate is joined to a die through solder bumps,
• the die is connected to a first thermal interface material (TIM),
• the first TIM is connected to a lid which is connected to a second TIM, and
• the second TIM is connected to a heat sink to enhance heat transfer away from the die.