High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihito Otsubo, Issei Yamamoto
Life of this patent
Estimating the term…
Abstract
The characteristics of a shield wall that prevents the mutual interference of the noise between components are improved by lowering the resistance of the shield wall. A high-frequency module 1a includes a wiring board 2, a plurality of components 3a to 3e mounted on an upper surface 2a of the wiring board 2, a sealing resin layer 4 stacked on the upper surface 2a of the wiring board 2 to seal the components 3a to 3e, and a shield wall 5 disposed between the adjacent components in the sealing resin layer 4. A part of the shield wall 5 is constituted of metal pins 5a standing on the upper surface 2a of the wiring board 2.
Claims17
A high-frequency module comprising:
- a wiring board;
- a plurality of components mounted on a principal surface of the wiring board;
- a sealing resin layer stacked on the principal surface of the wiring board to seal the plurality of components;
- and
- a shield wall disposed between one or more predetermined components and another one or more components among the plurality of components inside the sealing resin layer,
- wherein the shield wall has at least one metal pin standing on the principal surface of the wiring board,
- an upper end of the at least one metal pin is exposed from an opposite surface of the sealing resin layer to a surface of the sealing resin layer facing the principal surface of the wiring board,
- wherein the shield wall has a metal film filling a groove provided in the sealing resin layer, and a side surface of the metal film is in contact with a side surface of the at least one metal pin, the side surface of the at least one metal pin is connected to the upper end and a lower end of the at least one metal pin,
- a height of the metal pin is higher than a height of each of said plurality of components.
A high-frequency module comprising:
- a wiring board;
- a component mounted on a principal surface of the wiring board;
- a sealing resin layer stacked on the principal surface of the wiring board to seal the component;
- and
- a shield layer covering at least a part of a surface of the sealing resin layer,
- wherein the shield layer has a plurality of metal pins arranged on a side surface of the sealing resin layer,
- an upper end of each of the plurality of metal pins is exposed from an opposite surface of the sealing resin layer to a surface of the sealing resin layer facing the principal surface of the wiring board,
- wherein the shield wall has a metal film filling a groove provided in the sealing resin layer, and a side surface of the metal film is in contact with a side surface of the at least one metal pin, the side surface of the at least one metal pin is connected to the upper end and a lower end of the at least one metal pin,
- a height of the metal pin is higher than a height of each of said plurality of components.
Dependencies are inferred from the claim text.