Heat dissipation device and method, and electronic device
AssigneeLenovo (Beijing) Limited
InventorGuowen Zhang
Life of this patent
Estimating the term…
Abstract
A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.
Claims16
A heat dissipation device, comprising:
- a heat conducting cover configured to be disposed in an electronic device, the heat conducting cover forming a closed cavity accommodating a heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature decreases to a second threshold;
- a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
- wherein, in response to a temperature increase, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the heating element.
An electronic device, comprising:
- a housing;
- a heating element disposed within the housing;
- and
- a heat dissipation device disposed in the housing, wherein the heat dissipation device comprises:
- a heat conducting cover disposed on the heating element, the heat conducting cover forming a closed cavity accommodating the heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature of the electronic device increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature of the electronic device decreases to a second threshold;
- and
- a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
- wherein, in response to an increase in temperature of the heating element, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the heating element.
A heat dissipation method for an electronic device, comprising:
- disposing a heat dissipating device in the electronic device, the heat dissipation device comprising:
- a heat conducting cover disposed on a heating element of the electronic device, the heat conducting cover forming a closed cavity accommodating a heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature of the electronic device increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature of the electronic device decreases to a second threshold;
- and
- a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
- wherein, the heat absorbing material filler deforms structurally, in response to heat generated by the heating element, to absorb the heat generated from the heating element.
Dependencies are inferred from the claim text.