Sealed package including electronic device and power source

A hermetically-sealed package, comprising:

• a housing comprising an inner surface, an outer surface, and a cavity;
• a non-conductive substrate comprising a first major surface and a second major surface, wherein the non-conductive substrate is substantially transparent;
• an electronic device disposed on the first major surface of the substrate and comprising a device contact;
• a power source disposed at least partially within the cavity of the housing and comprising a resilient power source contact;
• and
• an electrode disposed on the second major surface of the substrate, wherein the electrode is electrically connected to the electronic device by a via formed between the first major surface and the second major surface of the substrate;
• wherein the substrate is hermetically sealed to the housing by a laser bond such that a non-bonded electrical connection is formed within the cavity of the housing between the device contact and the resilient power source contact.