Printed circuit board package and display device including the same
AssigneeSamsung Display Co., Ltd.
InventorHee Kwon Lee
Life of this patent
Estimating the term…
Abstract
A display device includes a display panel and a printed circuit board (PCB) connected to the display panel. The PCB includes an insulating base. A pressure sensor is disposed to overlap with the display panel. A fingerprint sensor is disposed to overlap with the display panel and is spaced apart, on a first side in a first direction, from the pressure sensor. A first distance from the pressure sensor to a first edge of the insulating base is greater than a second distance from the pressure sensor to a second edge of the insulating base opposite the fingerprint sensor.
Claims21
A display device comprising:
- a display panel;
- a printed circuit board (PCB) connected to the display panel and including an insulating base;
- a pressure sensor disposed to overlap with the display panel;
- a fingerprint sensor disposed to overlap with the display panel and spaced apart, on a first side in a first direction, from the pressure sensor;
- and
- a dummy structure on the insulating base, which is disposed between the pressure sensor and the fingerprint sensor,
- wherein a first distance from the pressure sensor to a first edge of the insulating base adjacent to the fingerprint sensor is greater than a second distance from the pressure sensor to a second edge of the insulating base opposite the fingerprint sensor.
A PCB package comprising:
- an insulating base;
- a pressure sensor disposed on the insulating base;
- a touch IC disposed on the insulating base and electrically connected to the pressure sensor,
- a dummy structure disposed on the insulating base and including a first dummy electrode, a second dummy electrode spaced apart from the first dummy electrode, and a dummy elastic layer disposed between the first dummy electrode and the second dummy electrode,
- wherein a first distance from the pressure sensor to a first edge of the insulating base is different from a second distance from the pressure sensor to a second edge of the insulating base opposite the first edge.
A PCB package comprising:
- a base;
- a pressure sensor disposed on the base;
- a dummy structure disposed on the base and including a first dummy electrxe, a second dummy electrode spaced at from the first dummy electrode, and a dummy elastic layer disposed between the first dummy electrode and the second dummy electrode, wherein the dummy structure is spaced apart from the pressure sensor;
- and
- a touch IC disposed on the base, wherein the touch IC is electrically connected to the pressure sensor, and wherein the touch IC is not electrically connected to the dummy structure,
- wherein the dummy structure is closer to an edge of the base than the pressure sensor.
Dependencies are inferred from the claim text.