Flexible semiconductor package and method for fabricating the same
AssigneeMagnaChip Semiconductor, Ltd.
InventorsKyeong Su Kim, Shin Park, Jae Jin Lee
Life of this patent
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Abstract
A semiconductor package attached to a curved display panel includes a semiconductor chip, having a top surface and a bottom surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel, a flexible cover layer attached to the top surface of the semiconductor chip, and an underfill material formed between the semiconductor chip and the curved flexible film, and wherein the top surface of the semiconductor chip is planar.
Claims27
A semiconductor package attached to a curved display panel, comprising:
- a semiconductor chip, having a top surface and a side surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel;
- a flexible cover layer attached to the top surface and the side surface of the semiconductor chip;
- and
- an underfill material formed between the semiconductor chip and the curved flexible film, and overlapping a solder resist,
- wherein the flexible cover layer is in direct contact with the underfill material, the solder resist, and the top and side surfaces of the semiconductor chip, and
- wherein the top surface of the semiconductor chip on the curved flexible film remains flat.
A semiconductor package attached to a curved display panel having front, rear and side surfaces, comprising:
- a semiconductor chip having a top surface, a side surface and a bottom surface disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel;
- an underfill material formed between the semiconductor chip and the curved flexible film and overlapping a solder resist;
- and
- a flexible cover layer formed on the top surface and the side surface of the semiconductor chip and being in direct contact with the underfill material, the solder resist, the top surface and the side surface of the semiconductor chip,
- wherein the semiconductor chip on the curved flexible film is attached to the side surface of the curved display panel, and
- wherein the bottom surface of the semiconductor chip on the curved flexible film is curved.
A semiconductor package attached to a curved display panel, comprising:
- a semiconductor chip attached to a curved flexible film to be disposed on the curved display panel;
- a flexible tape attached to an upper surface of the semiconductor chip;
- and
- an underfill material overlapping a solder resist and formed between a lower surface of the semiconductor chip and the curved flexible film,
- wherein the flexible tape comprises either one or both of heat conductive filler and a curable material.
Dependencies are inferred from the claim text.