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US 10,772,199 B2Granted
Low transmission loss copper foil and methods for manufacturing the copper foil
AssigneeChang Chun Petrochemical Co., Ltd.
InventorsChien-Ming Lai, Yao-Sheng Lai, Jui-Chang Chou
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Abstract
Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 μm3/μm2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
Claims20
A surface-treated copper foil comprising:
- an electrodeposited copper foil including a drum side and a deposited side, and
- a treatment layer disposed on the drum side providing a surface-treated side,
- wherein the treatment layer comprises a nodule layer and wherein the surface-treated side exhibits a material volume (Vm) in the range of 0.10 to less than 1.90 μm3/μm2.
A laminate comprising,
- a surface-treated copper foil and a resin layer in contact with a surface-treated side of the surface-treated copper foil,
- the surface-treated copper foil comprising
- an electrodeposited copper foil including a drum side and a deposited side,
- a treatment layer disposed on the drum side providing the surface-treated side, and
- wherein the treatment layer comprises a nodule layer,
- wherein the surface-treated side exhibits a material volume (Vm) in a range of 0.11 to 1.86 μm3/μm2,
- wherein the surface-treated copper foil has an oxygen content equal to or less than 468 ppm, a hydrogen content equal to or less than 29 ppm, and
- wherein after the surface-treated copper foil is subjected to heating at 200° C. for 1 hour, the surface-treated copper foil exhibits a tensile strength in a range of 21.3 to 45.1 kg/mm2.
5 more elements
Dependencies are inferred from the claim text.