Circuit board, circuit assembly, and circuit board manufacturing method
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorsTou Chin, Arinobu Nakamura
Life of this patent
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Abstract
A circuit board that includes a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed; a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which an electronic component is placed; and a terminal conductor foil that protrudes inward into the placement through hole from the lower surface and to which a terminal of the electronic component is connected.
Claims7
A circuit board for use with an electronic component, the circuit board comprising:
- a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed;
- a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which the electronic component is placed;
- and
- a terminal conductor foil that is provided on the lower surface of the substrate and which protrudes inward into the placement through hole, the terminal conductor foil being connected to the electronic component through the placement through hole.
A circuit assembly comprising:
- a circuit board that has an upper surface on which a circuit pattern is formed;
- a plurality of bus bars that are connected to the circuit board, the plurality of bus bars being spaced apart and fixed to a lower surface of the circuit board;
- and
- an electronic component that is placed on a bus bar of the plurality of bus bars, wherein
- the circuit board includes:
- a placement through hole that extends through the upper surface and the lower surface and faces the bus bar, and in which the electronic component is placed;
- and
- a terminal conductor foil that is provided on the lower surface of the substrate and which protrudes inward into the placement through hole, the terminal conductor foil being connected to the electronic component through the placement through hole.
A circuit board manufacturing method for use with an electronic component, the circuit board manufacturing method comprising:
- preparing a stacked plate that has upper and lower surfaces on each of which a conductor foil is stacked;
- performing hole forming processing on the stacked plate so as to form a through hole that extends through the upper and lower surfaces, the conductor foil being provided on the lower surface of the substrate such that the conductor foil protrudes inward into the through hole;
- forming a protrusion that protrudes inward into the through hole from the lower surface by causing a portion of the conductor foil on the lower surface of the stacked plate to remain in the through hole;
- and
- connecting the terminal conductor foil to the electronic component through the through hole.
A circuit board manufacturing method for use with an electronic component, the circuit board manufacturing method comprising:
- preparing a perforated stacked plate that has an upper surface on which a conductor foil is stacked, and a through hole that extends through upper and lower surfaces of the perforated stacked plate;
- bonding a conductor foil to the lower surface of the perforated stacked plate so as to cover the through hole, the conductor foil being provided on the lower surface of the substrate such that the conductor foil protrudes inward into the through hole;
- melting and removing a portion of the conductor foil that covers the through hole, and thereby forming a protrusion that protrudes inward into the through hole from the lower surface;
- and
- connecting the terminal conductor foil to the electronic component through the through hole.
Dependencies are inferred from the claim text.