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US 10,772,192 B2Granted
Board-to-board contactless connectors and methods for the assembly thereof
AssigneeKeyssa Systems, Inc.
InventorsRoger D. Isaac, Mostafa Naguib Abdulla
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.
Claims16
A device comprising:
- a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board;
- a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs, wherein each of the first and second CCUs comprises:
- a printed circuit board;
- a silicon die having a first side and a second side, wherein the first side is mounted to the printed circuit board;
- a dielectric layer disposed on the second side of the silicon die;
- a transducer disposed on the dielectric layer directly above the second side of the silicon die;
- a ground plane adjustment layer disposed on or within the dielectric layer, wherein the ground plane adjustment layer defines an effective ground plane for the transducer, and wherein the silicon die is an actual ground plane for the transducer and wherein the effective ground plane is different than the actual ground plane;
- and
- a collimating structure operative as a lens;
- and
- a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs.
8 more elements
A device comprising:
- a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board;
- a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs, wherein each of the first and second CCUs comprises:
- a printed circuit board;
- a silicon die having a first side and a second side, wherein the first side is mounted to the printed circuit board;
- a dielectric layer disposed on the second side of the silicon die;
- a transducer disposed on the dielectric layer directly above the second side of the silicon die;
- and
- a ground plane adjustment layer disposed on or within the dielectric layer, wherein the ground plane adjustment layer defines an effective ground plane for the transducer, and wherein the silicon die is an actual ground plane for the transducer and wherein the effective ground plane is different than the actual ground plane;
- and
- a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs.
7 more elements
Dependencies are inferred from the claim text.