Printed circuit board design for high speed application

A printed circuit board, comprising:

• a substrate having a top surface and a bottom surface;
• a plurality of first non-ground nets and a ground net disposed within a specific region on the top surface of the substrate;
• a second non-ground net and a split ground net disposed on the bottom surface of the substrate, wherein the second non-ground net is electrically connected to one of the plurality of first non-ground nets through a first via hole in the substrate, and wherein the second non-ground net is isolated from the split ground net by a gap;
• an outermost insulating layer on the bottom surface of the substrate and covering the second non-ground net and the split ground net;
• and
• a conductive layer disposed on the outermost insulating layer corresponding to the specific region of the substrate in which the plurality of first non-ground nets and the ground net are arranged, such that the conductive layer overlaps with the plurality of first non-ground nets.